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Apple iPhone Chip Level Learning Guide 2020
in this inside the iPhone 7 PDF Document, we are going to look at the entire iPhone 7 PCB, Identify ICs and their functions so stay tuned
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RF Antennas Just a few words on the external features before we move on to the inside Apple iPhone 7. Apple made it a point to highlight the ‘new antenna’ design being part of the enclosure. What we think Apple meant was you just can’t see the antenna from the outside. For quite some time now the RF antennas have been designed as part of a phone’s enclosure, and that is not just unique to Apple phones.
Apple iPhone 7 Board shots
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A10 Fusion Processor iPhone 7 had an A10 application processor from TSMC
Baseband
we see Intel’s Baseband Processor (Modem) PMB9943. We have confirmed that it is Intel XMM7360. whether we will find an Intel platform in the CDMA versions of the iPhone 7 and iPhone 7 Plus.
Power Management ICs
Intel’s PMB6826 is found in the iPhone 7. the X-PMU 736 is part of Intel’s XMM 7360 platform. While Intel handles its own cellular ICs, Dialog continues to have a presence in Apple phones.
Here we have the 338S00225, a new Apple/Dialog Semiconductor PMIC for the iPhone 7.
Flash Memory
it has a Toshiba THGBX6T0T8LLFXE 128 GB NAND memory IC also fabricated on 15 nm. Rumour has it the 256 GB version of the iPhone 7 will have 3D NAND.
NFC Controller
We found an NXP NFC Controller with package markings 67V04 (likely PN67V) in the iPhone 7. We will decap it to get the die photo to see if it is a new designed NFC controller.
Touch Screen Controller
The Touch Controller for the iPhone 7 is manufactured by Universal Scientific Industries (USI) with markings O1 1R. It was found under a metal shielding and though no markings were found on the IC, it is believed to be Analog Devices.
Wi-Fi
The WiFi / Bluetooth socket by Murata with a module part number 339S00199. These modules have historically been multi-component packages
GPS
Broadcom BCM47734 slot in the iPhone 7. This possibly contains Sensor Hub functionality as well like BCM4773 & BCM4774 seen in Samsung devices.
Audio ICs
The iPhone 7 still uses the same Apple/Cirrus Logic 338S00105 Audio Codec as in the iPhone 6S, but the Audio Amplifier has changed to the new 338S00220. (previously 338S1285 ) We found not just 2 but 3 Audio Amplifiers - we speculate there is one audio amplifier for each of the two speakers, and the third amplifier is for the headphone via the Lightning port.
The third Audio amplifier is situated next to the Applications Processor Module with 3 black blobs on it.
RF Front-end
Apple Skyworks for their GSM PA Low, Mid, or High band PA Modules. Those were covered by Avago (Broadcom) and Qorvo.
sockets located centrally between the two Intel RF transceivers. The following table highlights the RF design wins.
RF Transceiver
iPhone 7 with two Intel PMB5750s, or what they call their SMARTi 5 RF Transceivers. And at the end of this PDF some useful free resources to learn Chip level repairing Learn Apple iPhone Parts Identification with iphone parts diagram read more if you want to Go Further in Identify integrated circuits on iphone PCB and know their functions for troubleshooting click here if want to know about Samsung Galaxy motherboard, and Samsung Chip Level Repair part then visit Chip Level Repairing and get updated information
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I came across quite a number of questions about Apple iPhone Chip Level Repairing Help so that's why I publish this PDF Document. if you like this PDF! give Smartphone Repair Course App your review on Google play store so others can reach this App I love smartphone repairing and enjoys sharing with others what I have learned
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